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THUNDERBOLT™ TECHNOLOGY – high-speed, dual-protocol I/O technology from Intel
Developed by Intel (under the code name Light Peak), and brought to market with technical collaboration from Apple. Thunderbolt technology is a new, high-speed, dual-protocol I/O technology designed...
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Microsoft, Intel Don’t Entirely Agree on Next Windows
Chips based on ARM designs power Apple’s popular Iphone and iPad devices and devices that run Google’s Android software. Intel’s perceived momentum took another blow in January, when Microsoft said the...
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Ivy Bridge – Intel’s 22 nm die shrink of the Sandy Bridge microarchitecture
Ivy Bridge is the codename for Intel’s 22 nm die shrink of the Sandy Bridge microarchitecture based on tri-gate (“3D”) transistors. Ivy Bridge processors will be backwards-compatible with the Sandy...
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USB 3 – The Facts
USB 3.0 is the second major revision of the Universal Serial Bus (USB) standard for computer connectivity. The standard from 2008 implements a 5 Gbit/s transfer rate. In the late 1990s, the first...
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Elcome International – Productivity goes up using latest Microsoft Technology
Technical Story Elcome International based in Dubai, is a diversified supplier of turnkey solutions for marine electronics, electrical and safety systems for the world maritime industry. Founded in...
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Intel Compute Stick
If you’re interested in carrying your PC with you everywhere you go then Intel’s Compute stick might be the right device for you. Not much bigger than a regular USB stick, the device offers a Bay...
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A tablet can replace your laptop
Video..Surface Pro 3 Technical Specifications: Size: 11.5” x 7.93” x 0.36”(292.1mm x 201.4mm x 9.1mm) Weight: 1.76lbs(800 grams) Display: Screen: 12” ClearType Full HD Plus, Resolution: 2160 x 1440,...
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